Interfacial Phenomena in Reaction-Diffusion Systems

Arriving Sunday, July 31 and departing Friday August 5, 2022

Confirmed Participants

Name Affiliation
An, Jing Max Planck Institute
Angenent, Sigurd University of Wisconsin
Bates, Peter * Michigan State University
Berestycki, Henri Ecole des Hautes Etudes en Sciences Sociales Paris
Chen, Chiun-Chuan National Taiwan University
Ding, Weiwei South China Normal University
Du, Yihong University of New England
Ducasse, Romain LJLL, Université Paris Cité
Ducrot, Arnaud Le Havre Normandie University
Fang, Jian Harbin Institute of Technology
Fujiwara, Ryu Meiji University
Giletti, Thomas University of Lorraine
Girardin, Léo Université Claude Bernard Lyon-1
Graham, Cole Brown University
Gui, Changfeng University of Texas at San Antonio
Guo, Jong-Shenq Tamkang University
Hamel, Francois Universite d'Aix-Marseille
Hilhorst, Danielle CNRS and Universite Paris-Saclay
Ikeda, Kota Meiji University
Ito, Ryo Kanagawa University
Karali, Georgia University of Crete
Liang, Xing University of Science and Technology of China
Lou, Yuan Shanghai Jiao Tong University
Lou, Bendong Shanghai Normal University
Matano, Hiroshi Meiji University
Matsuzawa, Hiroshi Kanagawa University
Monobe, Harunori Osaka Metropolitan University
Mori, Ryunosuke Meiji University
Ninomiya, Hirokazu Meiji University
Nordmann, Samuel * University of Tel-Aviv
Polacik, Peter University of Minnesota
Roquejoffre, Jean-Michel Universite Paul Sabatier, Toulouse
Rossi, Luca Università Roma "Sapienza"
Shen, Wenxian Auburn University
Shimojo, Masahiko Tokyo Metropolitan University
Taniguchi, Masaharu Okayama University
Wei, Juncheng University of British Columbia
Wu, Chang-Hong National Yang Ming Chiao Tung University
Wu, Yaping Capital Normal University
Xiao, Dongyuan Meiji University
Zhang, Mingmin Université Paul Sabatier, Toulouse
Zhao, Xiaoqiang Memorial University of Newfoundland
Zhou, Maolin Nankai University
Zlatos, Andrej University of California San Diego

* This participant has indicated that they might be coming.